Product Code QSil553 Sub Group Encapsulant Description SILCOTHERM 2 Part Addition cure silicone encapasulant Feature 1 Thermally conductive Feature 2 UL94 V0 Approved file No. E205830 Feature 3 Low modulus Feature 4 1:1 Mix Ratio Pack Type 2-Part AB Rheology Liquid RTV or Heat cure Heat Acclerated RTV Cure Type Addition Colour Grey Colour A Part Beige Colour B Part Black CTE Linear ppm/ C 217 CTE Volumetric ppm/ C 650 Dielectric Constant 3.41 Dielectric Strength kV/mm >18 Dissipation Factor @ 60Hz 0 Duro Shore A 32 Elongation % 175 FDA No Max Cure Hrs @ 25C 24.00 Max Cure Mins @ 100C 7.00 Max Working Temp +C 260 Min Working Temp - C -55 Mix Ratio 1:1 Modulus @ 100% Strain MPa 0.60 Non Corrosive yes Pot Life mins 180 Self Bonding No SG 1.60 SG A Part 1.60 SG B Part 1.60 Shelf Life Mths 24 Tensile MPa 1.20 Thermal Conductivity W/mK 0.68 UL 94V-0 yes Viscosity A-Part mPas 5000 Viscosity B-Part mPas 3500 Viscosity Mixed mPas 4500 Volume Resistivity ohms cm 3.26E+14
